石 磊,蒋春磊,陈光海,唐永炳.薄膜热膨胀系数测试技术研究[J].集成技术,2017,6(4):49-60
薄膜热膨胀系数测试技术研究
The Study of the Testing Technique of Thermal Expansion Coefficient of Thin Films
投稿时间: 2017-04-12  最后修改时间: 2017-06-02
DOI:
中文关键词:  薄膜;热膨胀系数;弹性模量;残余应力
英文关键词:films; thermal expansion coefficients; elastic modulus; residual stress
基金项目:国家自然科学基金项目(51302238);广东省创新团队项目(2013C090);广东省科技计划项目(2014A010105032、2014A010106016、 2015A010106008、2014A030310226、2014A030310482);深圳市科技计划项目(JSGG20140417113430618、JSGG20140417113430647、 JSKF20150925163525547、JSGG20150602143328010);广东省工程中心项目(20151487);深圳市工程实验室项目(20151837);中科院院级科研 装备项目(yz201440)
作者单位
石 磊 中国科学院深圳先进技术研究院 深圳 518055 
蒋春磊 中国科学院深圳先进技术研究院 深圳 518056 
陈光海 中国科学院深圳先进技术研究院 深圳 518057 
唐永炳 中国科学院深圳先进技术研究院 深圳 518058 
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中文摘要:
      热膨胀系数是薄膜的重要热学性能参数,也是薄膜热应力和残余应力计算分析过程中的关键数 据。文章基于热诱导弯曲原理,分别采用单基片法和双基片法对氮化钛(TiN)和铝(Al)薄膜的热膨胀系 数进行测试,并着重对双基片法的测试误差和适用性进行了分析。研究结果表明,薄膜在不同材质基底 上弹性模量的差异是影响双基片法薄膜热膨胀系数测试精度的重要因素。当不同材质基片上薄膜弹性模 量差异较小时,双基片法测得的热膨胀系数与单基片法所获结果基本一致;而当不同材质基片上薄膜弹 性模量相差较大时,双基片法将不再适用。此外,文章结合薄膜的形貌、结构和残余应力表征测试,对 TiN 和 Al 薄膜热膨胀系数与其块体材料的差异进行了分析,结果显示残余压应力会导致薄膜热膨胀系数 增大,而残余拉应力则具有相反的效果。
英文摘要:
      The coefficient of thermal expansion (CTE) is an important thermal parameter for thin films, which is a critical issue in the calculation and analysis of the thermal stress and residual stress of thin films. In this paper, the CTEs of titanium nitride (TiN) and aluminum (Al) films were measured by single-substrate and dualsubstrate method based on the thermally induced bending principle, respectively. Feasibility and tolerance of the dual-substrate method were mainly investigated. The results show that difference in the elastic modulus of films is an important factor affects the calculation accuracy of CTEs tested by the dual-substrate method. When the difference of elastic modulus is small, the CTEs measured by the dual-substrate method agree well with the results by the single-substrate method. The dual-substrate method became inapplicable when there is big elasticmodulus difference of the films on different materials. In addition, the difference of CTE values between the thin film and bulk TiN and Al were also discussed according to the characterizations of the morphology, structure and residual stress of the films. The results also show that the compressive residual stress will increase the film CTE, while the tensile residual stress can decrease the film CTE.
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