用于薄晶圆加工的临时键合胶
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国家自然科学基金(21201175);广东省引进创新科研团队计划(2011D052);深圳市孔雀计划团队(KYPT20121228160843692);深圳 市电子封装材料工程实验室(深发改【2012】372 号)

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Temporary Adhesives for Thin Wafer Handling
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    摘要:

    通过堆栈电子器件的三维集成电路(3D-ICs) 能够缩小封装面积,并增加系统的容量和功能。在过去的几 十年中,基于薄晶圆( 通常厚度小于100 μm) 的硅穿孔(Through-Silicon Via,TSV) 技术已经实现了 3D-IC 封装。 但是由于薄晶圆的易碎性和易翘曲的倾向,在对器件晶圆进行背部加工过程中,需要利用胶粘剂将其固定在载体 上,并使薄晶圆在背部加工后易于从载体上剥离。文章介绍了用于此工艺的临时键合胶的研究现状,并对一种新 型的、基于热塑性树脂的临时键合胶性能进行了系统的考察。这种新型的胶粘剂表现出优异的流变性能、热稳定性、 化学稳定性和足够的粘接强度,并且易于剥离和清洗。这些研究成果拓展了可以应用于临时键合胶的聚合物范围, 对促进 TSV 技术的应用具有重要意义。

    Abstract:

    3D integrated circuits (3D-ICs) by stacking electronic devices can increase system capacity and functionality while decreasing the overall footprint. Through-silicon via (TSV) technology based on thin wafers (typically below 100 μm) has been developed to realize 3D-IC packaging over the last decades. Due to their fragileness and tendency of warping, thin device wafer needs to be bonded firmly to a carrier wafer during TSV processing and readily separated from the carrier after processing. The present research situation of temporary adhesive used in this processing was introduced in this paper, and the properties of a novel temporary adhesive based on thermoplastic resin were investigated systematically. This novel adhesive possesses excellent rheological properties, thermal stability, chemical resistance and sufficient bonding strength, and convenient post-processing. These results extend the candidate polymers for temporary bonding materials and can ultimately promote the practical application of the TSV technology.

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引文格式
帅行天,张国平,邓立波,等.用于薄晶圆加工的临时键合胶 [J].集成技术,2014,3(6):102-110

Citing format
SHUAI Xingtian, ZHANG Guoping, DENG Libo, et al. Temporary Adhesives for Thin Wafer Handling[J]. Journal of Integration Technology,2014,3(6):102-110

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  • 在线发布日期: 2015-01-07
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