基于纳米铜烧结互连键合技术的研究进展
基于纳米铜烧结互连键合技术的研究进展
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国家自然科学基金项目(51805197)

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The Development of Interconnection and Bonding Technology Based on Sintering of Nano-Cu
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National Natural Science Foundation of China (51805197)

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    摘要:

    第三代半导体与功率器件的快速发展对封装互连技术提出了新的需求,纳米铜、银烧结互连技术因其优异的导电、导热、高温服役特性,成为近年来第三代半导体封装进一步突破的关键技术。 其中,纳米铜相较于纳米银烧结具有明显的成本优势和更优异的抗电迁移性能,然而小尺寸铜纳米颗粒的制备、收集与抗氧化性都难以保证,影响了其低温烧结性能与存储、使用的可靠性。该文回顾了近年来面向第三代半导体与功率器件封装的纳米铜烧结技术的最新研究成果,分析了尺度效应、铜氧化物对烧结温度及扩散的影响,总结了键合表面纳米化修饰、铜纳米焊料的制备与烧结键合、铜纳米焊料氧化物自还原等多项技术的优势与特点,展望了烧结铜技术进一步面向产业化应用的研究方向。

    Abstract:

    The rapid development of third-generation semiconductors and power devices has put forward new requirements for packaging interconnection technology. Nano-copper and silver sintering interconnections have become the key technology to further breakthroughs in third-generation semiconductor packaging due to their excellent electrical conductivity, thermal conductivity, and hightemperature service characteristics. Compared to nano-silver, the nano-copper sintering technology has obvious advantages such as low-cost and better resistance to electromigration. However, the preparation, collection and oxidation resistance of small-sized copper nanoparticles are difficult to guarantee, which will affect the low-temperature sintering performance, and the reliability of use and storage. This paper reviews the latest research results of nano-copper sintering technology for third-generation semiconductor and power device packaging in recent years, analyzes the scale effect, the influence of copper oxide on sintering temperature and diffusion, and summarizes the advantages and characteristics of multiple technologies such as nano-modification of bonding surface, preparation and sintering of copper nano-solder, and self-reduction of copper nano-solder, prospects the research direction of nano-copper sintering technology for further industrial application.

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引文格式
史铁林,李俊杰,朱朋莉,赵 涛,孙 蓉.基于纳米铜烧结互连键合技术的研究进展 [J].集成技术,2021,10(1):3-13

Citing format
SHI Tielin, LI Junjie, ZHU Pengli, ZHAO Tao, SUN Rong. The Development of Interconnection and Bonding Technology Based on Sintering of Nano-Cu[J]. Journal of Integration Technology,2021,10(1):3-13

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  • 在线发布日期: 2021-01-26
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