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CAI Yali, LIU Lixia, DAI Wenbin, YU Liang, YUE Wenfeng, ZHANG Chong, GUO Quansheng, JIA Tingting, YU Shuhui. Failure Analysis of Ni-Cr Film Resistor in High Temperature and High Humidity Environment[J]. Journal of Integration Technology, 2022, 11(5): 88-98. DOI: 10.12146/j.issn.2095-3135.20220221001
Citation: CAI Yali, LIU Lixia, DAI Wenbin, YU Liang, YUE Wenfeng, ZHANG Chong, GUO Quansheng, JIA Tingting, YU Shuhui. Failure Analysis of Ni-Cr Film Resistor in High Temperature and High Humidity Environment[J]. Journal of Integration Technology, 2022, 11(5): 88-98. DOI: 10.12146/j.issn.2095-3135.20220221001

Failure Analysis of Ni-Cr Film Resistor in High Temperature and High Humidity Environment

  • The reliability of Ni-Cr alloy thin film resistors were tested by an aging test under an environment of 85 ℃ and 85% relative humidity for 3 000 h. The results show that the thin-film resistors exhibit two failure modes, resistance drift, and open circuit, after aging tests at 85 ℃ and 85% relative humidity. The failure mechanism of both failure modes was further analyzed, and the causes of failure were clarified. The failed resistors were examined by a 3D laser scanning microscope, scanning electron microscope, energy dispersive spectroscopy, and focused ion beam to analyze the cause of resistor failure. The results show that there is a crack in the terminal electrode of the film resistor. In addition to the obvious problems such as cracking, the electrode layer also showed sulfide corrosion of the Ag electrode.
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