中国电子科技集团公司第五十八研究所
The 58th Research Institute of China Electronics Technology Group Corporation, WuXi, Jiangsu 214035, China
王刚,叶刚,李奇哲,等.三维集成封装中光敏玻璃通孔制备工艺研究 [J].集成技术,
Citing format
WANG Gang, YE Gang, LI Qi Zhe, et al. Study on the preparation process of photosensitive glass through-hole in three-dimensional integrated package[J]. Journal of Integration Technology.