三维集成封装中光敏玻璃通孔制备工艺研究
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中国电子科技集团公司第五十八研究所

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Study on the preparation process of photosensitive glass through-hole in three-dimensional integrated package
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The 58th Research Institute of China Electronics Technology Group Corporation, WuXi, Jiangsu 214035, China

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    摘要:

    玻璃通孔转接板是一种典型的垂直传输结构,广泛的应用于三维集成封装电路中。根据射频信号对小直径、窄节距垂直通孔的使用需求,基于光敏玻璃衬底,采用紫外光曝光、热处理以及湿法刻蚀方法,获得了深宽比为8:1,最小直径为25.68μm的玻璃通孔。通过光敏玻璃通孔制备过程中曝光量对通孔制备工艺影响的研究,得到曝光过程中光敏玻璃的改性机理。实验结果表明,随着曝光量增加,通孔孔径增大,光敏玻璃改性过程是由表及里,由正面至背面逐渐改性的过程。这为玻璃通孔转接板的制备提供关键工艺支撑。

    Abstract:

    Glass through-hole adapter plate is a typical vertical transmission structure widely used in three-dimensional integrated package circuits. Based on the demand of RF signals for the use of small-diameter, narrow-pitch vertical vias, glass vias with a depth-to-width ratio of 8:1 and a minimum diameter of 25.68 μm were obtained based on a photosensitive glass substrate using UV exposure, heat treatment, and wet etching methods. The mechanism of modification of photosensitive glass during the exposure process was obtained by studying the effect of exposure amount on the through-hole preparation process of photosensitive glass through-hole preparation. The experimental results show that with the increase of exposure, the through-hole aperture increases, and the photosensitive glass modification process is a gradual modification process from the front to the back side from the surface to the inside. This provides key process support for the preparation of glass through-hole adapter plates.

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引用本文

王刚,叶刚,李奇哲,等.三维集成封装中光敏玻璃通孔制备工艺研究 [J].集成技术,

Citing format
WANG Gang, YE Gang, LI Qi Zhe, et al. Study on the preparation process of photosensitive glass through-hole in three-dimensional integrated package[J]. Journal of Integration Technology.

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  • 收稿日期:2023-07-31
  • 最后修改日期:2023-07-31
  • 录用日期:2023-07-31
  • 在线发布日期: 2023-07-31
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