| 任琳琳,王芳芳,曾小亮,孙 蓉,许建斌,汪正平.氮化硼纳米片/ 银纳米杂化颗粒填充的环氧树脂复合材料的制备及其性能研究[J].集成技术,2019,8(1):3-14 |
| 氮化硼纳米片/ 银纳米杂化颗粒填充的环氧树脂复合材料的制备及其性能研究 |
| Preparation and Property of Silver Nanoparticles-Deposited Boron Nitride Nanosheets/Epoxy Resin Composites |
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| DOI：10.12146/j.issn.2095-3135.20180913001 |
| 中文关键词: 氮化硼纳米片；银纳米颗粒；环氧树脂复合材料；介电性能；储能模量 |
| 英文关键词:boron nitride nanosheets; silver nanoparticles; epoxy resin composites; dielectric property; energy
storage modulus |
| 基金项目:科技部重点研究专项项目——高性能热界面材料基础研究(2017YFB0406000) |
| 作者 | 单位 | | 任琳琳 | 中国科学院深圳先进技术研究院 深圳 518055 | | 王芳芳 | 中国科学院深圳先进技术研究院 深圳 518055 | | 曾小亮 | 中国科学院深圳先进技术研究院 深圳 518055 | | 孙 蓉 | 中国科学院深圳先进技术研究院 深圳 518055 | | 许建斌 | 香港中文大学电子工程系 香港 999077 | | 汪正平 | 中国科学院深圳先进技术研究院 深圳 518055 |
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| 中文摘要: |
| 填充型高导热聚合物复合材料是目前解决电子器件散热问题的重要材料。基于此，该文通过
液相剥离和化学还原法制备了氮化硼纳米片/银纳米粒子(BNNSs/AgNPs)杂化粒子，并以此为填料制
备了 BNNSs/AgNPs/环氧树脂复合材料。前期研究工作证实通过 BNNSs/AgNPs 杂化粒子的填充，复合
材料的导热性能得到了有效提高。然而，复合材料其他方面的综合性能也相当重要。因此，通过热失
重、动态热机械性能以及介电性能测试对 BNNSs/AgNPs/环氧树脂复合体系的电学和力学性能进行考
察和分析。结果表明，杂化粒子的填充对复合材料热分解温度有所提高，复合物的介电常数随着填料
含量的增加而增加，BNNSs/AgNPs/环氧树脂的介电常数相对于 BNNSs/环氧树脂有进一步的提高。复
合材料的储能模量和玻璃化转变温度随着填料含量的增加而升高。相对于 BNNSs，BNNSs/AgNPs 杂
化粒子使得环氧树脂复合物的玻璃化转变温度进一步提高。BNNSs/AgNPs/环氧树脂复合材料良好的热
学、力学和电学性能，能进一步满足聚合物基复合材料在现代电子器件和设备封装领域的要求。 |
| 英文摘要: |
| Filled high thermally conductive polymer composites will be vital materials to resolve heat
dissipation problem in electronics. Herein, boron nitride nanosheet/silver nanoparticles (BNNSs/AgNPs)
hybrids were prepared through liquid exfoliation and chemical reduction method, and then were added into
epoxy resin (EP) to prepare BNNSs/AgNPs/EP composites. Previous study has proved that the thermal conductivities of the composites were enhanced with the addition of the BNNSs/AgNPs hybrids. Further, the over-all properties are also important to evaluate the performance of the polymer composites. In this
paper, electrical and mechanical properties of the BNNSs/AgNPs/EP composites were investigated by
thermogravimetric analysis, dynamic thermomechanical analysis and dielectric strength measurement. The result shows that the decomposed temperature is increased with the addition of BNNSs/AgNPs hybrids, the
dielectric constant is increased with the increase of the filler content, and the dielectric constant of BNNSs/
AgNPs/EP is higher than that of BNNSs/EP. Energy storage modulus and glass transition temperature are both increased with increasing the filler content. Compared with BNNSs, impregnation of BNNSs/AgNPs hybrids to the EP makes the composite with higher glass transition temperature. The results indicate that the obtained
BNNSs/AgNPs/EP composites, possessing good thermal, electrical and mechanical properties, will meet the
requirement in modern electronics packaging field. |
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