• Intelligent connected vehicles are equipped with advanced on-board sensors, controllers, actuators and other devices, and integrate modern communication and network technologies to realize information sharing between vehicles, roads, people, and clouds to achieve "safe, efficient, comfortable and energy-saving" driving. Although the industry shows a positive trend of comprehensive development, it is facing several technical adjustments on core technology level, including bicycle perception and decision-making, vehicle-road cooperation, human-machine co-driving, and various information security threats. In this context, it is crucial to carry out the technological innovation of intelligent networked vehicles. [MORE]
  • In recent years, the Chinese government has provided strong support for new energy vehicles and intelligent connected vehicles in terms of scientific and technological research, industrial development, application demonstration, and market promotion. Interestingly, China has become one of the most active countries in the field of new energy vehicles. Although the new energy vehicle industry has shown a good momentum in China, it has to overcome core technological barriers. [MORE]
  • Advanced electronic material is one of the three main elements of integrated circuit and is the foundation and support of electronic information industry. Trade frictions occurred in recent years fully illustrate the strategic importance of materials, especially electronic materials used in integrated circuit industry. In this context, we specially invited Professor Rong Sun, director of the Shenzhen Institute of Advanced Electronic Materials, as the guest editor to organize the special issue focused on high-end electronic packaging materials for integrated circuit, aiming to promote the exchange of basic research and industrial applications in the field of electronic materials, thereby promoting further innovation and development. [MORE]
  • It is great to announce that Professor Lintao Cai, Director of the Institute of Biomedicine and Biotechnology in Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, and Editorial Board Member of the Journal of Integration Technology, has been selected as the Fellow of International Association of Advanced Materials(IAAM Fellow) for his outstanding contributions to "Advancement of Materials to Global Excellence" . This is the second time that Professor Cai was recognized by international academic organizations since last year he was selected as the Fellow of American Institute for Medical and Biological Engineering (AIMBE Fellow). Congratulations! [MORE]
  • Recently, with the maturity and popularization of technologies such as Internet of Things, cloud computing, mobile internet, and Internet of Vehicles, massive data in various formats like images, audiovisual materials, and health files are rapidly generated. The International Data Corporation (IDC) predicted that global data volume would reach 175 ZB (approximately 175 billion TB) by 2025, which indicated that more than 99% of all data in human civilization were generated in recent years. [MORE]
  • With the rise of 5G communication, Internet of Things, new energy automotive electronics, wearable devices, and smart cities, affiliated electronic devices are developing towards the directions of miniaturization, high-power density, and multi-functionality. This will continue to increase the risk of overheating with related electronic devices. The development of high-performance thermal management materials is crucial to improve the heat dissipation of electronic devices, and it has become the biggest challenge faced by academia and application industry in electronic devices. [MORE]
Journal of Integration Technology (CN 44-1691/T, ISSN 2095-3135) was officially launched in May 2012 with the approval of the National Press and Publication Administration of China. The journal is supervised by the Chinese Academy of Sciences and sponsored by Shenzhen Institute of Advanced Technology(SIAT) alongside Science Press, the journal's publisher. Journal of Integration Technology is a peer-reviewed open-access journal published bi-monthly. It focuses on high quality works from multidisciplinary fields that involve integration(e.g.information technology, biotechnology, and other multidisciplinary integration), which includes but not limited to the following four areas: big data and smart city [MORE]
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    Volume 10, No. 1 | 2021
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    • SHI Tielin, LI Junjie, ZHU Pengli, ZHAO Tao, SUN Rong

      2021,10(1):3-13, DOI: 10.12146/j.issn.2095-3135.20200916001

      Abstract:

      The rapid development of third-generation semiconductors and power devices has put forward new requirements for packaging interconnection technology. Nano-copper and silver sintering interconnections have become the key technology to further breakthroughs in third-generation semiconductor packaging due to their excellent electrical conductivity, thermal conductivity, and hightemperature service characteristics. Compared to nano-silver, the nano-copper sintering technology has obvious advantages such as low-cost and better resistance to electromigration. However, the preparation, collection and oxidation resistance of small-sized copper nanoparticles are difficult to guarantee, which will affect the low-temperature sintering performance, and the reliability of use and storage. This paper reviews the latest research results of nano-copper sintering technology for third-generation semiconductor and power device packaging in recent years, analyzes the scale effect, the influence of copper oxide on sintering temperature and diffusion, and summarizes the advantages and characteristics of multiple technologies such as nano-modification of bonding surface, preparation and sintering of copper nano-solder, and self-reduction of copper nano-solder, prospects the research direction of nano-copper sintering technology for further industrial application.

    • ZHANG Chenxu, MAO Dasha, ZENG Xiaoliang, SUN Rong, XU Jianbin, WONG Chinping

      2021,10(1):14-22, DOI: 10.12146/j.issn.2095-3135.20201223001

      Abstract:

      Al2O3-AlN/silicone rubber composites with high thermal conductivity were prepared by using Al2O3 and AlN as thermally conductive fillers. By using theory of granulartity, we obtained the densest packing of fillers in the polymer composites. The results showed that the thermal conductivity of the composites reached up to 9.6 W/(m?K) at the loading of 96 wt%, which was 60% higher than that filled with Al2O3. The significant increase of the thermal conductivity of the composites resulted from the increase of the internal thermal conductivity of the sample. Although the composites have undergone extreme cold and hot cycle application conditions, the thermal conductivity of the composites was maintained well, showing excellent reliability.

    • LIU Qiang, XIA Jianwen, LI Xujun, SUN Deliang, HUANG Mingqi, CHEN Wei, ZHANG Guoping, SUN Rong

      2021,10(1):23-34, DOI: 10.12146/j.issn.2095-3135.20200925001

      Abstract:

      As a key technology to solve advanced manufacturing and packaging, temporary bonding technology, as a high reliability solution for the processing of thin wafer devices, has attracted more and more attention. According to the different ways of de-bonding, thermal slip de-bonding material system and ultraviolet laser de-bonding material system are introduced in this paper. Thermal slip de-bonding materials (WLP TB130 and WLP TB140) were manufactured. Both of materials showed higher heat resistance and chemical resistance properties than foreign products. And the 5% weightlessness of materials were over 400 ℃. WLP TB140 even could be separated from the supporting waferat 160 ℃ by thermal-slipde-bonding technique. Ultraviolet laser de-bonding material system with release layer (WLP LB210) and adhesive layer (WLP TB4130) was manufactured, ultra-thin device bonded were separated from the supporting wafer using ultraviolet laser at room temperature and stress free.

    • GUO Yongfu, WANG Riming, YU Shuhui, CHU Baojin, SUN Rong

      2021,10(1):35-46, DOI: 10.12146/j.issn.2095-3135.20201119001

      Abstract:

      The use of Tantalum (Ta) electrolytic capacitors as embedded components constitutes a promising strategy to extend the application of embedded capacitors, because Ta electrolytic capacitor can provide both high capacitance and excellent stability. However, the huge thickness of conventional Ta electrolytic capacitor makes it hard to be embedded in a printed circuit board or substrate. In this work, we propose to employ the electrochemical etching of thin Ta foils to fabricate the anode of Ta electrolytic capacitors for embedded application.The specific capacitance of electrochemically etched Ta anode reaches as high as 74 nF/mm2 when measured in 0.1 mol/L H2SO4.The etched Ta anode is then fabricated into electrolytic capacitors, and a stable capacitance of >30 nF/mm2 is demonstrated in the frequency range from 100 Hz to 1 MHz and a low leakage current of 2.7×10-6 A for a duration of 1 200 seconds at a direct voltage (DC) of 10 V. The whole thickness of the capacitor is decreased to~75 μm.

    • YANG Yuanyuan, LI Gang, ZHU Pengli, ZHANG Chao, WU Houya, PENG Xiaohui, SUN Rong, WONG Chingping

      2021,10(1):47-54, DOI: 10.12146/j.issn.2095-3135.20200927001

      Abstract:

      The reliability of solder joints is one of the key concerns in electronic packaging. Underfill was employed to match the thermal expansion coefficient between the substrate and the IC chip in electronic packaging, thereby protecting the solder joints and improving the reliability of the solder joints. However, the reliability of solder bumped flip chip will be affected by the changes in performance of underfill during the aging process. Therefore, the effects of several aging treatments on the thermo-mechanical properties and adhesion of underfill were studied in this paper. The thermo-mechanical properties of the underfill have the most obvious changes after hydrothermal aging treatment and high-temperature storage life treatment. There is no obvious similarity on organic interface and the inorganic interface for adhesion of underfill. High temperature storage has the most obvious effect on the adhesion of inorganic interfaces, while hydrothermal aging has the most obvious effect on the organic interfaces.

    • HUANG Jing, LI Zhongguo, GAO Liyin, LI Xiao, LI Zhe, LIU Zhiquan, SUN Rong

      2021,10(1):55-62, DOI: 10.12146/j.issn.2095-3135.20200924001

      Abstract:

      Nanotwinned copper has excellent properties of high strength, high conductivity and high toughness, which makes it a research hotspot in the field of electronic packaging in recent years. During the electrodeposit procedure, the additives play a vital role in the quality and property of nanotwinned copper. Among these additive, methylene blue is commonly used in the direct-current (DC) electroplating regular copper industry. In this study, the effect of methylene blue on the microstructure and mechanical property of nanotwinned copper was investigated. It was found that the microscopic morphology and mechanical properties of nanotwinned copper are closely related to the concentration of methylene blue. As the concentration increases, the growth rate of electrodeposits shows a decreasing tendency, demonstrating a strong grain refinement effect. When the methylene blue concentration is 2 mg/L, columnar grains start growing from the bottom substrate to upper surface, and there exists a high-density twin structure within the columnar grains. What’s more, the tensile strength of the film at this concentration is 194 MPa, which is almost twice as that of regular coarse-grain copper (about 110 MPa) as measured by the dynamic thermomechanical analyzer (DMA). The surface hardness of the film can reach 1.6 GPa, which is also higher than the hardness of coarse-grained copper.

    • LI Chenglong, ZHONG Cheng, LIU Yongchao, GUO Rui, LU Jibao, SUN Rong

      2021,10(1):63-73, DOI: 10.12146/j.issn.2095-3135.20201119002

      Abstract:

      With the rapid development of the electronic packaging industry, the industry’s requirements for the reliability of packaging structures are becoming more and more stringent. At present, most people regard Poisson’s ratio as a fixed value, which will affect reliability prediction to a certain extent. In order to further improve the reliability, it is of important engineering practical significance to properly consider the influence of the material Poisson’s ratio on the package structure. This paper uses finite element method (FEM), through design chip simulation and board-level packaging simulation, to explore the effects of Poisson’s ratio of epoxy molding compound on the chip warpage, chip interface stress, and the impact of board-level packaging solder joint life. Through analysis, it can be known that the variable EMC Poisson’s ratio has a greater impact on the warpage of the package structure, and it may cause the chip interface to be delamination and the chip to reach the stress limit and damage. In addition, it is necessary to properly consider the influence of Poisson’s ratio on the fatigue life of solder joints. Especially with the continuous development of chips in the direction of large size, the study of material Poisson’s ratio will have more important significance.

    • CHEN Tao, ZHOU Guoyun, LI Jiujuan, HE Wei, YANG Meng, ZHANG Binbin, FEI Jingming, BI Jianmin, WANG Shouxu, CHEN Yuanming

      2021,10(1):74-83, DOI: 10.12146/j.issn.2095-3135.20200703001

      Abstract:

      In the aerospace power module, the voltage value of the line is as high as 300 V, which requires good insulation between the lines. The insulation resistance between lines is not likely to be an ideal state due to various factors influenced in the manufacturing process of flexible circuits. In particular, the seed layer between the lines would strengthen the conduction capacity between the flexible lines, thus the resin insulation between the lines is weakened. In this paper, the high-voltage conductive anode filament (CAF) high-current transmission requirements are established, and the corresponding high-voltage breakdown model is established to compare the CAF resistance of flexible circuits at different distances between lines by COMSOL. In addition, a model with or without polyimide as the medium is established to compare the line loss at a high current of 10 A. At the same time, we varied the thickness of polyimide in the model to study the temperature change around the circuit. The simulation results show that the spacing between the lines is 2 mm under high current, regardless of whether there is a seed layer between the lines, the lines have good breakdown resistance, which provides an overall solution for the design of flexible circuits.

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      • XIONG Gang,MENG Jiao,CAO Zi-gang,WANG Yong,GUO Li,FANG Bin-xing

        2012,1(1):32-42, Doi:

        Abstract:

        Nowadays, with the rapid development of the Internet, more and more new applications appear gradually, the scale of network expand constantly, and the architecture of network is more and more complicated. As one of the basic technologies for enhancing network controllability, traffic classification can not only provide better QoS for ISPs, but also supervise and manage network effectively, which can ensure the security of the Internet. In this paper we review the research methods and achievements in the field of traffic classification, compare these traditional methods, and point out their advantages and disadvantages. On the other hand, for the real challenges of real-time classification of high-speed network environment, encrypted traffic classification, fine-grained traffic classification, and dynamically changed protocols classification, we describe and analyze the related research progress. Finally, we look ahead the future research direction.

      • ZHANG Wen-li

        2012,1(3):20-24, Doi:

        Abstract:

        Gene is the genetic material basis. All life phenomena, like disease and death, are related to Gene. Gene sequencing is a way to read life. With the development of new generation high-throughput sequencing technology, TB or more sequence data will be generated daily. It’s more difficult to interpret these big and complex data than to acquire them. Sequence data interpretation is a critical step in current biological research and has great practical significance. It’s a great challenge for current computer systems and computing models to store, process and analysis massive high throughput sequence data. With survey, especially from BGI (Beijing Genome Institute), the current status, problems and measures taken to process high throughput sequence data will be discussed. However, the challenge is too big to be solved unless more people in different fields work together in depth for a long term.

      • LIU Qun

        2012,1(1):48-54, Doi:

        Abstract:

        This paper gives a comprehensive introduction to the status of current machine translation research and technology, and analyzes the key problems to be resolved. Finally our idea of the future trends and prospects of machine translation are put forward.

      • SONG Zhang-jun

        2012,1(3):1-9, Doi:

        Abstract:

        The technology of the robot represents a national high-tech level and the degree of automation. It is helpful to develop the industry of service robots in China if we know the current situation and development trend of service robots research clearly. Recently, robotic cleaners and educational robots have been in great demand. Entertainment robots and surveillance robots are developed rapidly and the market expands quickly. Medical robots begin to enter the modern life and have played an important role in the modern surgery. To satisfy the great market and shorten the distance between China and developed countries, it is necessary to capture the development trend of the technology of service robots. R&D on service robots should focus on the integrated technologies on intelligence, modularization and network.

      • XU Guo-qing,XU Kun,LI Wei-min

        2012,1(1):6-14, Doi:

        Abstract:

        With the increasing concerns of global warming and resource constraints, electric vehicles (EVs) have made great progress during the past decade. The electric driving system of EVs has dinstinct advantages, such as quick response, easy measurement , and precise control of motor torque, available flexible driving architecture, and regenerative braking, etc. Such advantages can be used to improve the performance of vehicle dynamic control. This paper presents the recent research efforts on electric vehicle dynamic control in terms of parameters estimation and dyanmic control scheme and methodology, especially focusing on the tire-road friction estimaion , novel traction control methods. The lateral dynamic control including the electrical differential control, direct yaw moment control, and the integratin chassis cotrol is proposed. Several prospects for vehicle dynamic control are proposed.

      • SHEN Yang,LING Tao,YAO Hui,LI Yan-ming,JIN Qiao-feng,ZHENG Hai-rong

        2012,1(1):93-99, Doi:

        Abstract:

        For the advantages of noninvasive, real-time and quantitative detection, ultrasonic transient elastography has important clinical application value. This work investigates the transient elastography in a few ways and aims to design a transient imaging system. The Displacement tracking algorithm based on correlation techniques and the parabolic interpolation algorithm is proposed to improve the accuracy. A novel match filter is designed to convolute with the estimated displacement in the time direction to boost the SNR of the displacement for a better strain image mapping. The convoluted result shows the match filter can significantly improve the strain image quality and help getting more accurate Youngs modulus estimation. The Time Gain Compensation (TGC) circuit is designed to compensate the attenuated power of the ultrasound signal. And a modified polyacrylamide gel based tissue-mimicking phantom is also developed in this paper, both indentation testing and transient elastography are used to characterize the elastic properties of this phantom. The results are almost consistent with each other.

      • HU Chao,SONG Shuang,YANG Wan-an,MENG Qing-hu,LI Bao-pu,ZENG De-wen,LI Xiao-xiao,ZHU Hong-mei

        2012,1(1):105-113, Doi:

        Abstract:

        Wireless Capsule Endoscope (WCE) is a very promising tool for the examination of the gastrointestinal (GI) tract. However, there are some problems to be solved for the existed WCE, and one key problem is the accurate localization and tracking of the WCE. Among the possible localization methods, the magnet-based localization technique has its advantages: no need for power, not much space occupation, continuously tracking ability, and no negative effect. In this paper, we present the localization method for the magnet objective inside the WCE based on the magnetic sensor array outside the human body. Through the algorithm and system design we realize real time tracking of 3D position and 2D orientation of the magnet based on the magnetic dipole model. In order to overcome the interference of the human body movement, we propose the multi-magnets’ localization method; also, the 3D positioning and 3D orientation method is proposed, which can be used to make the 3D recovery of the GI tract and the accurate computation of the physiological tissue parameters. The real experiments show that the proposed localization system can run well and obtain the accuracy with 2~3mm for the magnet.

      • GAO Ming,HUANG Zhe-xue

        2012,1(3):47-54, Doi:

        Abstract:

        With the rapid increase in numbers and scales of deep web sites on the Internet, search for data or information from deep web sites by submiting queries to and obtaining results from the backend databases has become a major means in information retrieval from the Web. This area has attracted many researchers to devote their efforts on development of technologies to make better use of information in th deep web. One challenge is searching for and integration of data from various databases in deep web. Since deep web is dominated by text data, research and development of technologies for text information retrieval from deep web have a broad application potential. In this paper, we review the state-of-the-art of deep web research in details and propose some future research directions.

      • LUO Li,YANG Chao,ZHAO Yu-bo,CAI Xiao-chuan

        2012,1(1):84-88, Doi:

        Abstract:

        Several of the top ranked supercomputers are based on the hybrid architecture consisting of a large number of CPUs and GPUs. High performance has been obtained for problems with special structures, such as FFT-based imaging processing or N-body based particle calculations. However, for the class of problems described by partial differential equations (PDEs) discretized by finite difference (or other mesh based methods such as finite element) methods, obtaining even reasonably good performance on a CPU/GPU cluster is still a challenge. In this paper, we propose and test an hybrid algorithm which matches the architecture of the cluster. The scalability of the approach is implemented by a domain decomposition method, and the GPU performance is realized by using a smoothed aggregation based algebraic multigrid method. Incomplete factorization, which performs beautifully on CPU but poorly on GPU, is completely avoided in the approach. Numerical experiments are carried out by using up to 32 CPU/GPUs for solving PDE problems discretized by FDM with up to 32 millions unknowns.

      • MA Xiao-yan,HONG Jue

        2012,1(3):66-71, Doi:

        Abstract:

        Hadoop job schedulers typically use a single resource abstraction and resources are allocated at the level of fixed-size partition of the nodes, called slots. These job schedulers ignore the different demands of jobs and fair allocation of multiple types of resources, leading to poor performance in throughput and average job completion time. This paper studies and implements a Muti-resource Fair Scheduler (MFS) in Hadoop. MFS adopts the idea of Dominant Resource Fairness (DRF). It uses a demand vector to describe demands for resources of a job and allocates resources to the job according to the demand vector. MFS uses resources more efficiently and satisfies multiple jobs with heterogeneous demands for resources. Experiment results show that MFS has higher throughput and shorter average job completion time compared to Hadoop slot-based Fair Scheduler and Capacity Scheduler.

      • XIA Wei,LI Huiyun

        2017,6(3):29-40, Doi:

        Abstract:

        Automatic drive is an important application field of artificial intelligence. In this paper, a novel training strategy for self-driving vehicles was investigated based on the deep reinforcement learning model. The proposed method involves a Q-learning algorithm with filtered experience replay and pre-training with experiences from professional drivers, which accelerates the training process due to reduced exploration spaces. By resampling the input state after clustering, generalization ability of the strategy can be improved due to the individual and independent distribution of the samples. Experimental results show that, in comparison with conventional neural fitted Q-iteration algorithm, the training efficiency and controlling stability can be improved more than 90% and 30% respectively by the proposed approach. Experimental results with more complex testing tracks show that, average travel distance can be improved more than 70% in comparison with the Q-learning algorithm by the proposed method.

      • CHI Xue-bin,XIAO Hai-li,WANG Xiao-ning,CAO Rong-qiang,LU Sha-sha,ZHANG Hong-hai

        2012,1(1):68-76, Doi:

        Abstract:

        This paper introduces the scientific computing grid, ScGrid, and it’s middleware SCE. ScGrid is built as one virtual supercomputer, integrating computing resource from more than 30 institutes. It provides unified,?easy to use and reliable scientific computing services. SCE is a lightweight grid middleware, which supports global job scheduling and unified data view. It provides multiple user interfaces including command line, grid portal and APIs. At present, ScGrid has been very successfully used in Chinese Academy of Sciences and widely accepted by more than 200 users.

      • ZHANG Hao-shi,WU Zhen-xing,TIAN Lan,YANG Lin,LI Guang-lin

        2012,1(1):114-118, Doi:

        Abstract:

        Effectively reducing power line interference is always an important issue in electromyography (EMG) signal recordings and analysis. In this study, four commonly used de-noising methods, including digital notch, LMS based adaptive filter, Kalman filter and S transform, which may be suitable for the reduction of power line interference in real-time EMG recordings, were chosen and their performance in reducing the power line interference from EMG signal recordings were quantitatively analyzed and compared. The pilot results of this study showed that Kalman filter presented the best whole performance in attenuating power line interference from EMG signals and S transform de-noising method illustrated the best performance when the power line interference was severe.

      • XU Zhi-wei,LI Guo-jie

        2012,1(1):20-25, Doi:

        Abstract:

        Thirty years ago, the invention and volume shipment of IBM PC significantly enlarged the user population of computing. For the next thirty years, what is the most fundamental challenge of the computing field? What paradigm shift is needed? What is the most significant industrial problem? What are the most needed scientific breakthroughs? This article addresses these questions by discussing a dozen essential issues of computing for the masses. The most fundamental challenge is the computing market’s growth stagnation. Computing for the masses is proposed to reverse this trend and should be a fundamental future direction. It has three features of value-augmenting, affordability, and sustainability. The most basic paradigm shift is human-cyber-physical ternary computing. The most significant industrial problem is the Insecta Classis paradox. Computing for the masses needs five pillars of science support, including ternary computing science, universal compute account, efficient sea-network-cloud computing platforms, information ecosystem science, and national information accounts. This article helps outline the problem space for future computer science research, with a discussion on related transformative research projects.

      • WU Zhen,ZHOU Hui,LI Guang-lin

        2013,2(4):56-60, Doi:

        Abstract:

        Foot drop is the inability to voluntarily dorsiflex the ankle during the swing phase of gait and is usually caused by weakness and damages of the peroneal nerve. The consequences of the foot drop include the decreasing of gait quality, the limiting of mobility, the increasing of falling risk, and great increasing of energy expenditure during walking. Firstly biosignal sensors are used in the drop foot stimulator to detect foot movements. Then the surface drop foot stimulator produces a predefined stimulation profile to the peroneal nerve or tibialis anterial to elicit a dorsiflexion of the foot synchronized with the swing phase of gait to lift the foot. This paper reviewed the fundamentals and current researches of drop foot stimulators. Moreover, the development trends of the closed loop drop foot stimulator were also discussed in the paper.

      • XU Tian-chen,WU En-hua

        2012,1(1):77-83, Doi:

        Abstract:

        In the past work for long time, since the computation required on object deformation and interaction is intensive, when fluid is interacted with rigid bodies, or especially with animating figure, the demand of real-time simulation and rendering could be hardly achieved. This paper presents a novel approach for generating effects simulated by fluid dynamics and interacted by the figure motions. In order to handle the interaction between fluid effect and deformed figure, firstly, the motion trajectory of character is tracked, and then the fluid dynamics is simulated by the model of Smoothed-Particle Hydrodynamics (SPH). Moreover, during the fluid simulation, an efficient algorithm for particle searching is also proposed, in virtue of parallel processing by GPU. Consequently, the simulation of 3D fluid effects with realistic character interaction can be rendered on a consumer-level PC in real-time.

      • ZHU Peng-li,SUN Rong,WONG Ching-ping

        2012,1(3):35-41, Doi:

        Abstract:

        Nanomaterials and nanotechnology play more and more important role in the field of new generation electronics packaging. The unique electrical, magnetic and optical properties of the nanomaterials along with their composites can enhance and improve the physical and mechanical properties of the components. Current issues of electronic packaging, especially those related to materials, are introduced and evaluated in this review. The nanomaterials, nanocomposites and nanotechnology have advantages in solving these issues and their future development direction. This review also focuses on the application of new materials such as, conductive metal particles, silica, carbon nanotubes, graphene, etc. in the high density system level packages.

      • WANG Hui

        2013,2(4):49-55, Doi:

        Abstract:

        Transcranial magnetic stimulation (TMS) is a non-invasive technique that can be used for brain studying and clinical therapy. Firstly, the technology feature and application of the TMS instrument were introduced. Then several TMS coil positioning methods were evaluated and several key problems about TMS coil positioning were discussed. The aim of this study was to propose a new method for TMS coil positioning. The new method combines three aspects of quantitative information including the brain scalp, brain anatomy and brain function and has great advantages and broad application prospects.

      • ZHAO Wen-chuang,CHENG Jun

        2012,1(3):10-14, Doi:

        Abstract:

        Human action recognition acts as an important role in human machine interaction. This paper proposes a human body recognition method from depth image based on part size and position features. Random forest classifiers are trained with different parameters. Experimental results demonstrate the feasibility of proposed approach. Recognition accuracy is about 91% and the computation time is about 0.96 us per pixel.

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      • LIU Qun

        2012,1(1):48-54, Doi:

        Abstract:

        This paper gives a comprehensive introduction to the status of current machine translation research and technology, and analyzes the key problems to be resolved. Finally our idea of the future trends and prospects of machine translation are put forward.

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      • HUI Chang-ye,ZHANG Xi,HUANG Sheng-he

        2012,1(3):28-34, Doi:

        Abstract:

        Defibrotide is a polydisperse oligonucleotide with multiple effects on endothelial cells, which has been developed for the treatment of different vascular disorders. Defibrotide has been used effectively in the treatment and prophylaxis of hepatic veno-occlusive disease. Recent animal models have clearly suggested an antiangiogenic effect and an anticancer activity. Further in vitro and in vivo investigations are needed.

        • 1
      • YU Xinjie,WU Xiongfei,Wang Jianping,CHEN Li,WANG Lei

        2012,3(5):45-51, Doi:

        Abstract:

        Morphological parameter measurement of Pseudosciaena Crocea plays an important role in its genetic selection and quality improvement. In this paper, an automatic detecting system which can measure the Pseudosciaena Crocea morphological parameters such as weight, length and body width was developed based on the machine vision and weighing sensor technology. The system can automatically detect the external morphology parameters by the machine vision, and get weight parameters through the weighing sensor. The mean errors of dimensional measurement and weighting are 0.28% and 0.74% respectively, which shows that the developed system can completely meet the requirements of morphological parameter measurement for Pseudosciaena Crocea. It is a new effective method to the automatic detection of fish morphology parameters.

        • 1
      • ZENG Xiaoliang,SUN Rong,YU Shuhui,XU Jianbin,WONG Chingping

        2012,3(6):76-83, Doi:

        Abstract:

        The main functions of substrates in electronic packaging include supporting, cooling, protection of semiconductor chips, as well as insulation and electronic interconnection with external chips. With the electronic packaging developing towards high speed, multi-functionalization, high performance, good stability and small dimension, substrates play more and more important role in the field of new generation electronics packaging. Scientists and engineers have higher requirement to substrate materials, which advances their brilliant progress. In this review, the characteristic, recent progress and future development of three kinds of substrates were summerized, including ceramic, composite and organic substrates.

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      • LIU Hengwei,LI Jianjun,XIE Xiaoyi,FANG Mou,WANG Li,HE Xiangming,OUYANG Minggao,LI Maogang

        2012,4(1):51-59, Doi:

        Abstract:

        In this work the thermal behavior of the LiNi1/3Co1/3Mn1/3O2 cathode material for soft packed lithium-ion power batteries during charging and discharging at different C-rate were conducted using the ARC (accelerating rate calorimeter) to provide an adiabatic environment. The overall heat generated by the lithium-ion battery during use, is partly reversible and partly irreversible, due to entropy change and joule heating, respectively. It indicates that the heating generation of lithium-ion cell is decided by the C-rate of charge and discharge. The heat is smaller at low C-rate of charge and discharge. For example, the heating generation of battery increases 7.16℃ at 0.2C-rate and the entropy change heat is clearly embodied. The joule heating is more remarkable than the entropy change during charging and discharging at high C-rate. For instance, the heating generation of cell increased 25.63℃ at 1C-rate. The heat generation of charge is less than discharge at the same C-rate. The DC inter insistence of cell at the SOC (State of Charge) of 0 to 10% increases suddenly, so the heating generation power will reach its maximum in this period during discharge. It is valuable for the design of heat dissipation in lithium-ion battery thermal management.

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