电子封装基板材料研究进展及发展趋势
电子封装基板材料研究进展及发展趋势
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广东省引进创新科研团队计划(2011D052 );深圳市孔雀计划团队(KYPT20121228160843692);三维高密度基板及高性能 CPU 封装技术 研发与产业化,国家 02 专项(2011ZX02709);深圳市电子封装材料工程实验室(深发改【2012】372 号)

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The Research Development and Trend of Substrates in Electronic Packages
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    摘要:

    基板材料在电子封装中主要起到半导体芯片支撑、散热、保护、绝缘及与外电路互连的作用。随着电子 封装技术向着高频高速、多功能、高性能、小体积和高可靠性方向发展,电子封装基板材料在新一代电子封装材 料中发挥着越来越重要的作用。科学与工业界对电子封装基板材料提出了更高的要求,同时也促进了电子封装基 板材料飞速发展。文章分别针对三大类基板材料:陶瓷基板、复合材料基板和有机基板的特点、发展现状及未来 发展趋势进行了阐述。

    Abstract:

    The main functions of substrates in electronic packaging include supporting, cooling, protection of semiconductor chips, as well as insulation and electronic interconnection with external chips. With the electronic packaging developing towards high speed, multi-functionalization, high performance, good stability and small dimension, substrates play more and more important role in the field of new generation electronics packaging. Scientists and engineers have higher requirement to substrate materials, which advances their brilliant progress. In this review, the characteristic, recent progress and future development of three kinds of substrates were summerized, including ceramic, composite and organic substrates.

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引文格式
曾小亮,孙 蓉,于淑会,许建斌,汪正平.电子封装基板材料研究进展及发展趋势 [J].集成技术,2014,3(6):76-83

Citing format
ZENG Xiaoliang, SUN Rong, YU Shuhui, XU Jianbin, WONG Chingping. The Research Development and Trend of Substrates in Electronic Packages[J]. Journal of Integration Technology,2014,3(6):76-83

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  • 在线发布日期: 2015-01-07
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