面向超薄器件加工的临时键合材料解决方案
面向超薄器件加工的临时键合材料解决方案
作者:
作者单位:

作者简介:

通讯作者:

基金项目:

广东省重点领域研发计划项目(2020B010180001)

伦理声明:



Temporary Bonding Materials Solution for Ultra-thin Device Processing
Author:
Ethical statement:

Affiliation:

Funding:

Key-Area Research and Development Program of Guangdong Province (2020B010180001)

  • 摘要
  • |
  • 图/表
  • |
  • 访问统计
  • |
  • 参考文献
  • |
  • 相似文献
  • |
  • 引证文献
  • |
  • 资源附件
    摘要:

    临时键合技术作为一项解决先进制造与封装的关键工艺,可为薄晶圆器件的加工提供一种高可靠性的解决方案。该文成功研发出热滑移解键合和紫外激光解键合两种不同解键合方式的临时键合材料。结果显示,与国外同类产品相比,热滑移临时键合材料 WLP TB130 和 WLP TB140 具有更高的耐热性,5% 的热失重温度均大于 400 ℃,同时也具有更好的耐化性,其中 WLP TB140 可在 160 ℃ 实 现低温解键合。紫外激光解键合材料为 WLP TB4130 与 WLP LB210 配合使用(WLP TB4130 作为黏结 层,WLP LB210 作为激光释放层),超薄器件晶圆键合对通过激光解键合方式实现室温、无应力地与支撑晶圆分离。

    Abstract:

    As a key technology to solve advanced manufacturing and packaging, temporary bonding technology, as a high reliability solution for the processing of thin wafer devices, has attracted more and more attention. According to the different ways of de-bonding, thermal slip de-bonding material system and ultraviolet laser de-bonding material system are introduced in this paper. Thermal slip de-bonding materials (WLP TB130 and WLP TB140) were manufactured. Both of materials showed higher heat resistance and chemical resistance properties than foreign products. And the 5% weightlessness of materials were over 400 ℃. WLP TB140 even could be separated from the supporting waferat 160 ℃ by thermal-slipde-bonding technique. Ultraviolet laser de-bonding material system with release layer (WLP LB210) and adhesive layer (WLP TB4130) was manufactured, ultra-thin device bonded were separated from the supporting wafer using ultraviolet laser at room temperature and stress free.

    参考文献
    相似文献
    引证文献
引用本文

引文格式
刘 强,夏建文,李绪军,孙德亮,黄明起,陈 伟,张国平,孙 蓉.面向超薄器件加工的临时键合材料解决方案 [J].集成技术,2021,10(1):23-34

Citing format
LIU Qiang, XIA Jianwen, LI Xujun, SUN Deliang, HUANG Mingqi, CHEN Wei, ZHANG Guoping, SUN Rong. Temporary Bonding Materials Solution for Ultra-thin Device Processing[J]. Journal of Integration Technology,2021,10(1):23-34

复制
分享
文章指标
  • 点击次数:
  • 下载次数:
  • HTML阅读次数:
历史
  • 收稿日期:
  • 最后修改日期:
  • 录用日期:
  • 在线发布日期: 2021-01-26
  • 出版日期: