Abstract: In the Post-Moore Era, the integrated circuit industry has shifted toward system integration optimization, with advanced packaging emerging as the core approach to enhancing chip performance. Polymer-based advanced packaging materials act as critical support for the process feasibility and reliability of advanced packaging technologies. In the global market, Japanese enterprises monopolize the high-end segment, while German and American players hold advantages in subdivided fields. Although China has accelerated its catching-up pace, the domestic industrial self-sufficiency rate remains below 10%, with weak capabilities for an independent and controllable supply chain. Technological constraints have consistently been the root cause of the slow development of domestic materials. For instance, photosensitive polyimide, a critical packaging material, is confronted with the synergistic challenges of low-temperature curing, high resolution, and low dielectric loss. High-end epoxy molding compounds must resolve the contradiction between low coefficient of thermal expansion, high filler loading, and low viscosity. Build-up dielectric films are limited by the trade-off between fine-line compatibility and dielectric uniformity. Coupled with common bottlenecks such as the significant coefficient of thermal expansion mismatch between polymers and silicon-based chips and the difficulty in regulating heterogeneous interfaces, these issues severely impede industrial advancement. Therefore, an in-depth analysis of the stringent technical index requirements for polymer-based advanced packaging materials and the resolution of fundamental common problems represent the fundamental pathway to breaking the foreign high-end monopoly, improving the self-sufficiency rate of domestic materials, and achieving independent control of the supply chain.