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芯粒集成芯片的测试与可测试性设计技术

Testing and Design for Testability Technology of Chiplet-Based Integrated Chips

  • 摘要: 芯粒集成芯片的测试和可测试性设计是芯粒集成芯片的核心问题。现有方法主要利用芯粒集成芯片的自身架构,对芯粒集成芯片的路由器、物理互连和逻辑内核进行测试。本文首先介绍了电气电子工程师学会(Institute of Electrical and Electronics Engineers, IEEE)针对芯片测试和芯粒集成芯片测试提出的标准,再根据芯粒集成芯片中常见的故障类型,分别介绍了针对固定故障及开路和短路故障的测试与可测试性设计技术;其次,介绍了测试数据传输、片上网络路由算法和测试调度的相关技术和研究;再次,介绍了常用的芯粒集成芯片的商业测试软件和工业界测试组件,并分析了这些软件和组件的具体结构;最后,展望了芯粒集成芯片测试和可测试性设计技术的未来发展方向。

     

    Abstract: The testing and design for testability of chiplet-based integrated chips constitute a central challenge in this domain. Existing approaches leverage the inherent architecture of system on chips to test routers, physical interconnects, and logic cores. This paper first reviews the standards proposed by IEEE (Institute of Electrical and Electronics Engineers) for testing conventional chips as well as systems on chips. And then categorizes common fault models in chiplet-based integrated chips and introduces corresponding testing and design for testability techniques for stuck-at faults and physical interconnect faults such as open and short faults. Subsequently, it surveys relevant technologies and research on test data transmission, routing algorithms for network on chips, and test scheduling. Furthermore, it examines widelyused commercial testing tools and components for chiplet-based integrated chips, analyzing their architectural characteristics in detail. Finally, it discusses potential future directions for the development of testing and design for testability techniques in chiplet-based integrated chips.

     

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