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基于环氧树脂/ 钛酸钡/ 聚酰亚胺绝缘介质的PCB 埋嵌电容的制作及性能研究(英文)

Fabrication and Characterization of Embedded Capacitors in PCB Using Epoxy/BaTiO3/PI Capacitor CCL

  • 摘要: 文中使用叠层技术制作了以环氧树脂/ 钛酸钡/ 聚酰亚胺为绝缘介质的 PCB 埋嵌电容器。制作的电容器容值与设计值之间误差在 - 4.0% 到 - 6.0% 之间。通过将电容器面积增加 5%, 电容器容值误差降低到了 - 1.1% 以下。为了检测埋嵌电容器的可靠性, 分别进行了 260℃ 回流焊、高低温冷热冲击、85℃ /85% RH 及高压击穿测试。测试结果表明, 以环氧树脂/ 钛酸钡/ 聚酰亚胺为绝缘介质的 PCB 埋嵌电容器有良好的环境可靠性, 适合用于制作PCB 埋嵌电容器。

     

    Abstract: The embedded capacitors in PCB (Printed Circuit Board) were fabricated using commercial epoxy/BaTiO3/PI capacitor CCL in conventional PCB build-up process. Capacitance measuring demonstrated the tolerances of the obtained capacitors ranged from -4.0% to -6.0%, and special design to compensate the capacitor geometry significantly decreased the tolerance to -1.1%. Reflow process at 260℃, high thermal cycling, 85℃/85% RH and high-voltage breakdown tests were performed to evaluate the reliability of embedded capacitors. It is summarized that the fabrication of epoxy/BaTiO3/ PI composite embedded capacitors is successfully demonstrated using conventional PCB build-up processes, and their environmental reliability are evaluated to be excellent.

     

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