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胶体量子点短波红外光电技术与单片集成:进展与挑战

Colloidal Quantum Dot Short-Wave Infrared Photoelectric Technology and Monolithic Integration:Progress and Challenges

  • 摘要: 短波红外光电技术在医学诊断、遥感探测、红外成像等领域展现出广阔的应用前景。传统红外材料(如InGaAs、HgCdTe)成本高、工艺复杂、难以与硅基CMOS集成等问题,限制了其进一步发展。胶体量子点作为一种溶液可加工、带隙可调、与CMOS工艺兼容的新型半导体材料,为短波红外光电探测与成像提供了低成本和单片集成的可行路径。本文综述了PbS、HgTe等胶体量子点材料体系的光电特性、器件结构设计及其在单片集成方面的最新进展,并探讨了人工智能技术在光电传感器优化与智能感知中的应用。文章最后指出了当前技术面临的挑战,并对未来发展方向进行了展望。

     

    Abstract: Short-wave infrared photoelectric technology has shown broad application prospects in medical diagnosis, remote sensing detection, infrared imaging and other fields. Traditional infrared materials ( such as InGaAs and HgCdTe ) have high cost, complex process, and difficulty in integrating with silicon-based CMOS, which limits their further development. As a new semiconductor material with solution processability, adjustable band gap and compatibility with CMOS process, colloidal quantum dots provide a feasible path of low cost and monolithic integration for short-wave infrared photoelectric detection and imaging. In this paper, the photoelectric properties, device structure design and latest progress in monolithic integration of colloidal quantum dot materials such as PbS and HgTe are reviewed, and the application of artificial intelligence technology in photoelectric sensor optimization and intelligent perception is discussed. Finally, the paper points out the challenges faced by the current technology and looks forward to the future development direction.

     

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