Abstract: In the Post-Moore Era, the integrated circuit (IC) industry has shifted toward system integration optimization, with advanced packaging emerging as the core approach to enhancing chip performance. Polymer-based advanced packaging materials act as critical support for the process feasibility and reliability of advanced packaging technologies.In the global market, Japanese enterprises monopolize the high-end segment, while German and American players hold advantages in subdivided fields. Although China has accelerated its catching-up pace, the domestic industrial self-sufficiency rate remains below 10%, with weak capabilities for an independent and controllable supply chain.Technological constraints are the root cause of the slow development of domestic materials. For example, the large mismatch in the coefficient of thermal expansion between polymers and silicon-based chips, together with the great difficulty in balancing multiple performance indicators, has severely impeded the industrial advancement.Therefore, it is essential to focus on core materials such as photosensitive polyimide and epoxy molding compound, conduct in-depth analysis of their stringent technical requirements including high thermal stability, low dielectric constant and low loss, and tackle common fundamental issues like heterogeneous interface regulation.In the future, with the evolution of co-packaged optics (CPO), glass substrates and other technologies, polymer-based materials with synergistically optimized multi-performance will provide core support for the high-density integration of integrated circuits.