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芯粒集成芯片的测试与可测试性技术

Overview of Testing and Design for Testability Technology of Chiplet-based Integrated Chips

  • 摘要: 芯粒集成芯片的测试和可测试性设计(Design for Testability, DFT)是芯粒集成芯片的核心问题,复用芯粒集成芯片自身的架构,对芯粒集成芯片的路由器、物理互连和逻辑内核进行测试。文章首先介绍了IEEE针对芯片测试以及芯粒集成芯片测试提出的标准,再根据芯粒集成芯片中常见的故障类型,对固定故障和开路、短路故障分别介绍了测试与DFT技术;接下来介绍了测试数据传输、片上网络路由算法和测试调度的相关技术和研究;而后,针对常用的芯粒集成芯片测试用商业软件和工业界测试组件进行了介绍,分析了其具体结构。文章最后展望了芯粒集成芯片测试和DFT技术的未来发展方向。

     

    Abstract: The testing and design for testability (DFT) of chiplet-based integrated chips constitute a central challenge in this domain. Existing approaches leverage the inherent architecture of chiplet systems to test routers, physical interconnects, and logic cores. The thesis first reviews the standards proposed by IEEE for conventional chip testing as well as chiplet-based system testing. It then categorizes common fault types in chiplet systems and introduces corresponding testing and DFT techniques for stuck-at faults and interconnect faults such as open and short defects. Subsequently, it surveys relevant technologies and research on test data transmission, network-on-chip routing algorithms, and test scheduling. Furthermore, it examines widely used commercial testing tools and industrial testing components for chiplet systems, analyzing their architectural characteristics in detail. Finally, it discusses potential future directions for the development of testing and DFT techniques in chiplet-based integrated chips.

     

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