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我国先进封装材料产业生态的现状、问题与发展路径研究

Research on Current Situation, Problems and Development Path of China's Advanced Packaging Material Industrial Ecosystem

  • 摘要: 先进封装材料是支撑AI等大算力芯片落地的核心底层物理支撑,直接决定芯片封装工艺与性能上限,其产业生态协同性是半导体产业自主可控的关键。我国先进封装材料产业生态整体健康度偏低,高端材料对外依存度高,国产替代推进缓慢,本土材料市场导入面临多重瓶颈。产业存在底层技术积累不足、验证周期长成本高、下游应用壁垒高、行业同质化内卷等问题,本土企业盈利能力薄弱。需通过技术协同攻关、搭建公共验证平台、破除采购壁垒、规范行业秩序,完善产业生态,加速国产替代与市场导入,夯实半导体产业自主可控的材料根基。

     

    Abstract:   In the post-Moore era, advanced packaging has become a core competitive track in the semiconductor industry. As the fundamental physical support for the implementation of AI and other high-computing power chips, advanced packaging materials directly determine the limits of chip packaging technology and performance, and the coordination of its industrial ecosystem is the key to realizing the independent controllability of China's semiconductor industry.
      This study aims to solve the development dilemma of China’s advanced packaging material industrial ecosystem, accelerate the process of domestic substitution, and consolidate the material foundation for the independent controllability of the semiconductor industry. By sorting out the industrial development status and analyzing core bottlenecks, it is concluded that the overall health of China's advanced packaging material industrial ecosystem is insufficient, the localization rate of core products remains at a low level, the market introduction of local materials faces multiple constraints, and relevant enterprises generally have weak profitability. The industry is confronted with prominent problems including insufficient accumulation of underlying technologies, long-cycle and high-cost product verification, high access barriers in downstream applications, and low-end homogeneous involution, making it difficult to form a sound development cycle. Based on the above status and problems, this study proposes a solution centered on ecological coordination. It suggests improving the industrial ecosystem in an all-round way by promoting collaborative research on key technologies, building a public professional verification platform, breaking downstream procurement access barriers, and standardizing the benign competition order of the industry.
      The research results show that the proposed path can effectively accelerate the domestic substitution and market introduction of advanced packaging materials, resolve industrial development dilemmas, consolidate the key material foundation for the independent controllability of China's semiconductor industry, and promote the sustainable and sound development of the industry.

     

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