Abstract: Advanced packaging materials are the core underlying physical foundation underpinning the deployment of AI and other high-computing-power chips, and directly define the upper limits of chip packaging processes and performance. The synergy of their industrial ecosystem holds the key to building an independent and controllable semiconductor industry. China's advanced packaging materials industrial ecosystem is generally underdeveloped: the country relies heavily on foreign supply for high-end materials, the localization of the supply chain progresses slowly, and the market adoption of domestic materials faces multiple bottlenecks. The sector is beset by problems including insufficient underlying technology accumulation, lengthy and costly verification cycles, high downstream application barriers, and intensifying homogeneous competition, leaving domestic enterprises with weak profitability. It is imperative to pursue collaborative technological breakthroughs, build public verification platforms, break down procurement barriers and standardize industry order, so as to improve the industrial ecosystem, accelerate the market adoption and large-scale application of domestic materials, and consolidate the material foundation for the independent and controllable development of China's semiconductor industry.