基于环氧树脂/ 钛酸钡/ 聚酰亚胺绝缘介质的PCB 埋嵌电容的制作及性能研究(英文)
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Guangdong Innovative Research Team Program(201001D0104713329)

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Fabrication and Characterization of Embedded Capacitors in PCB Using Epoxy/BaTiO3/PI Capacitor CCL
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    摘要:

    文中使用叠层技术制作了以环氧树脂/ 钛酸钡/ 聚酰亚胺为绝缘介质的 PCB 埋嵌电容器。制作的电容器容 值与设计值之间误差在 - 4.0% 到 - 6.0% 之间。通过将电容器面积增加 5%,电容器容值误差降低到了 - 1.1% 以 下。为了检测埋嵌电容器的可靠性,分别进行了 260℃ 回流焊、高低温冷热冲击、85℃ /85% RH 及高压击穿测试。 测试结果表明,以环氧树脂/ 钛酸钡/ 聚酰亚胺为绝缘介质的 PCB 埋嵌电容器有良好的环境可靠性,适合用于制作 PCB 埋嵌电容器。

    Abstract:

    The embedded capacitors in PCB (Printed Circuit Board) were fabricated using commercial epoxy/BaTiO3/PI capacitor CCL in conventional PCB build-up process. Capacitance measuring demonstrated the tolerances of the obtained capacitors ranged from -4.0% to -6.0%, and special design to compensate the capacitor geometry significantly decreased the tolerance to -1.1%. Reflow process at 260℃, high thermal cycling, 85℃/85% RH and high-voltage breakdown tests were performed to evaluate the reliability of embedded capacitors. It is summarized that the fabrication of epoxy/BaTiO3/ PI composite embedded capacitors is successfully demonstrated using conventional PCB build-up processes, and their environmental reliability are evaluated to be excellent.

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引文格式
周国云,何 为,王守绪,等.基于环氧树脂/ 钛酸钡/ 聚酰亚胺绝缘介质的PCB 埋嵌电容的制作及性能研究(英文) [J].集成技术,2014,3(6):14-22

Citing format
ZHOU Guoyun, HE Wei, WANG Shouxu, et al. Fabrication and Characterization of Embedded Capacitors in PCB Using Epoxy/BaTiO3/PI Capacitor CCL[J]. Journal of Integration Technology,2014,3(6):14-22

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  • 在线发布日期: 2015-01-07
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