倒装芯片封装技术概论
作者:
作者单位:

作者简介:

通讯作者:

基金项目:

广东省引进创新科研团队计划(2011D052);深圳市孔雀计划团队(KYPT20121228160843692);深圳市电子封装材料工程实验室(深 发改【2012】372 号)

伦理声明:



An Introduction to Flip-Chip Packaging Technology
Author:
Ethical statement:

Affiliation:

Funding:

  • 摘要
  • |
  • 图/表
  • |
  • 访问统计
  • |
  • 参考文献
  • |
  • 相似文献
  • |
  • 引证文献
  • |
  • 资源附件
    摘要:

    高密度电子封装正朝着小型化、高 I/O 密度、更好的散热性和高的可靠性方向发展,传统引线键合技术 已经无法满足要求。先进的倒装芯片封装技术由于具有较高的单位面积内 I/O 数量、短的信号路径、高的散热 性、良好的电学和热力学性能,在电子封装中被广泛关注。底部填充胶被填充在芯片与基板之间的间隙,来降低 芯片与基板热膨胀系数不匹配产生的应力,提高封装的稳定性。然而,流动底部填充胶依赖于胶的毛细作用进行 填充,存在很多缺点。为了克服这些缺点,出现了非流动底部填充胶,以改善倒装芯片底部填充工艺。文章回顾 了倒装芯片封装技术的发展,阐述了流动和非流动底部填充胶的施胶方式和性质。

    Abstract:

    As the high density package is moving towards miniaturization, high I/O density, better thermal and high reliable system, the conventional wire bonding technology can not satisfy the product need already. The advanced flip chip technology is highly expected due to its high area array I/O interconnection, short signal path, high thermal dissipation, high electrical and thermal performance. In order to enhance the reliability of a flip-chip on organic board package, underfill is used between the chip and the substrate to redistribute the thermo-mechanical stress created by the coefficient of thermal expansion (CTE) mismatch between the silicon chip and organic substrate. However, the conventional underfill relies on the capillary flow of the underfill material and has many disadvantages. In order to overcome these disadvantages, no-flow underfill has been invented to improve the flip-chip underfill process. This paper reviews the development of flipchip technology and expounds the behavior of flow and no-flow underfill.

    参考文献
    相似文献
    引证文献
引用本文

引文格式
张文杰,朱朋莉,赵 涛,等.倒装芯片封装技术概论 [J].集成技术,2014,3(6):84-91

Citing format
ZHANG Wenjie, ZHU Pengli, ZHAO Tao, et al. An Introduction to Flip-Chip Packaging Technology[J]. Journal of Integration Technology,2014,3(6):84-91

复制
分享
文章指标
  • 点击次数:
  • 下载次数:
  • HTML阅读次数:
历史
  • 收稿日期:
  • 最后修改日期:
  • 录用日期:
  • 在线发布日期: 2015-01-07
  • 出版日期: