Abstract: With the characteristic of low coefficient of thermal expansion, high heat resistance, high wet resistance and low dielectric constants, silica could effectively reduce the coefficient of thermal expansion, water absorption, contraction ratio and inner stress of epoxy resin. So, silica has been widely used in the field of electronic packaging. The Sol-Gel methods developed in recent years for preparation of silica spheres, the process factors, and the study of being filled with epoxy resin were reviewed in this article. And the problems and development direction of silica applied in the field of electronic packaging were pointed out as well.