Abstract: After low temperature sintering, nano Cu paste produces the homogeneous interconnection structure with high temperature resistant, high electrical conductivity and thermal conductivity, which can not only avoid service reliability with the bridging problems caused by short circuit and electromigration of tin based solder layer and sintered Ag layer, but also solve the problem of thermal expansion coefficient mismatch of heterogeneous interconnection structure, and has important application value in integrated circuits and power device packaging. In recent years, the sintering interconnection technology of nano Cu paste has made significant research progress in the stability of Cu nanoparticles and low-temperature sintering performances. However, compared with the sintering interconnection technology of nano Ag paste, it still has much room for improving the stability, low temperature sintering performance and reliability of nano Cu paste. This paper describes the important research progress of nano Cu paste sintering interconnection technology from the sintering interconnection mechanism, sintering process optimization, Cu nanoparticle surface modification, nano Cu based composite paste, interconnection reliability, and packaging application, and prospects the follow-up technology development and research ideas.