Integration and Application of Flexible Thermoelectrics on Microelectronic Integrated Circuits

Rising circuit integration intensifies thermal runaway risks in conventional silicon-based devices during high-frequency and high-power applications. Therefore, it is necessaryto develop effective thermal management strategies for silicon-based systems and to explore alternative non-silicon materials. Flexible thermoelectric conversion technology addresses these challenges by enabling simultaneous active cooling of silicon devices and sustainable power generation for flexible electronics, establishing it as a research hotspots in microelectronics. This paper systematically examines the fundamental principles of thermoelectric cooling and energy harvesting. It reviews design strategies for chip-level thermal management and flexible thermoelectric self-powered systems, with a focus on innovations in thermoelectric materials, microscale engineering, thin-film architectures, and novel structural designs. Furthermore, the paper discusses comprehensive self-powered system architectures, including energy harvesting techniques, power management circuits, and storage solutions. Finally, it explores synergistic integration with multi-energy systems and cross-disciplinary advancements enabled by artificial intelligence, providing theoretical frameworks and practical guidance to facilitate the large-scale deployment of next-generation microelectronics.