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Articles in press have been peer-reviewed and accepted, which are not yet assigned to volumes/issues, but are citable by Digital Object Identifier (DOI).
Design of Compression-Type Thermoelectric Device Based on Flexible Contact Interface and Elastic Connection
ZHANG Zongwei, CAI Jianfeng, CHEN Zhiyu, WANG Yu, LIU Guoqiang, WU Jiehua, SUN Peng, LI Mancang, JIANG Jun
DOI: 10.12146/j.issn.2095-3135.20250726001
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Thermal Evaporation Method for Preparing Ag2Se Flexible Thin Films and Devices
WU Yuji, ZHONG Yiming, CHEN Ni, XU Hanwen, ZHONG Zinan, LIU Pengjuan, CHEN Yuexing, LI Yingzhen, ZHENG Zhuanghao
DOI: 10.12146/j.issn.2095-3135.20250630003
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Synergistic Optimization of Seebeck Coefficient and Lattice Thermal Conductivity in p-type Yb-filled Skutterudites
MA Fumin, MIN Erbiao, TAN Yinghua, SUN Shikuan, LIU Ruiheng
DOI: 10.12146/j.issn.2095-3135.20250809001
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Research on Thermal Power Generation System in Simulated Service Environment of High Speed Aircraft
CHEN Yanan, LI Bo, YU Peng
DOI: 10.12146/j.issn.2095-3135.20250802001
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Research Progress and Prospects of SnTe-Based Thermoelectric Materials and Devices
LI Jinbo, SUN Chenyue, ZHANG Qinyong, GUO Muchun
DOI: 10.12146/j.issn.2095-3135.20250629002
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The Application of Artificial Intelligence in the Research of Thermoelectric Materials
WANG Xiangdong, JI Jialin, YANG Jiong
DOI: 10.12146/j.issn.2095-3135.20250715001
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Precise Temperature Control Algorithm of PPO-PID Thin Film Thermoelectric Cooling Chip Based on Power Stratification
WANG Yunyi, LI Meiyong, ZHANG Yijing, SHEN Limei
DOI: 10.12146/j.issn.2095-3135.20250629001
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Integration and Application of Flexible Thermoelectric Technology on Microelectronic Circuits
CHEN Kunhao, LIU Wenjing, ZHANG Wantian, LU Yao
DOI: 10.12146/j.issn.2095-3135.20250716001
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Application of Mesoporous Bioactive Glass in Protein Targeted Degradation
YU Xuan, YANG Changjiang, CUI Xu, CHEN Liang
DOI: 10.12146/j.issn.2095-3135.20250323001
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