Research Progress on the Life Prediction Model of Solder Joint Reliability in Electronic Devices

With the development of electronic devices towards high power density and miniaturization, the reliability of solder joints as critical interconnect structures has become increasingly prominent. This review systematically summarizes the research progress in reliability life prediction models for solder joints of electronic components, and compares the applicability and limitations of classical models such as Coffin-Manson (C-M, a low-cycle fatigue model based on plastic strain), Engelmaier (a C-M modified model considering temperature cycling frequency), and Syed model (a cumulative damage model based on creep energy density). It indicates that the Norris-Landzberg acceleration model, by simultaneously considering multiple variable parameters such as cycling frequency, temperature variation range, and maximum temperature, demonstrates unique advantages in characterizing the synergistic effects of complex thermal stress and temperature variation stress. After parameter modification, this model exhibits high predictive accuracy in the evaluation of storage life for electronic products, providing a theoretical basis for the selection and optimization of solder joint life prediction models, and offering insights into future directions for model improvement.