Filled high thermally conductive polymer composites will be vital materials to resolve heat dissipation problem in electronics. Herein, boron nitride nanosheet/silver nanoparticles (BNNSs/AgNPs) hybrids were prepared through liquid exfoliation and chemical reduction method, and then were added into epoxy resin (EP) to prepare BNNSs/AgNPs/EP composites. Previous study has proved that the thermal conductivities of the composites were enhanced with the addition of the BNNSs/AgNPs hybrids. Further, the over-all properties are also important to evaluate the performance of the polymer composites. In this paper, electrical and mechanical properties of the BNNSs/AgNPs/EP composites were investigated by thermogravimetric analysis, dynamic thermomechanical analysis and dielectric strength measurement. The result shows that the decomposed temperature is increased with the addition of BNNSs/AgNPs hybrids, the dielectric constant is increased with the increase of the filler content, and the dielectric constant of BNNSs/ AgNPs/EP is higher than that of BNNSs/EP. Energy storage modulus and glass transition temperature are both increased with increasing the filler content. Compared with BNNSs, impregnation of BNNSs/AgNPs hybrids to the EP makes the composite with higher glass transition temperature. The results indicate that the obtained BNNSs/AgNPs/EP composites, possessing good thermal, electrical and mechanical properties, will meet the requirement in modern electronics packaging field.
REN Linlin, WANG Fangfang, ZENG Xiaoliang, SUN Rong, XU Jianbin, WONG Chingping. Preparation and Property of Silver Nanoparticles-Deposited Boron Nitride Nanosheets/Epoxy Resin Composites[J]. Journal of Integration Technology,2019,8(1):3-14Copy