Key-Area Research and Development Program of Guangdong Province (2020B010180001)
LIU Qiang, XIA Jianwen, LI Xujun, SUN Deliang, HUANG Mingqi, CHEN Wei, ZHANG Guoping, SUN Rong. Temporary Bonding Materials Solution for Ultra-thin Device Processing[J]. Journal of Integration Technology,2021,10(1):23-34
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