基于 OLED 器件的封装材料研究进展
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国家自然科学基金(21201175);广东省引进创新科研团队计划(2011D052);深圳市孔雀计划团队(KYPT20121228160843692);深圳 市电子封装材料工程实验室(深发改【2012】372 号)

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Research Progress of Encapsulation Materials for OLED
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    摘要:

    有机电致发光器件(Organic Light-Emitting Diode,OLED) 因其轻薄、视角广、响应时间短、发光效率高、 成本低等优点成为公认的新一代显示技术。为减少甚至避免有机发光材料受到外界环境的侵蚀、保证 OLED 的使 用寿命,OLED 封装材料得到了大力的研究和发展。OLED 封装材料必须具有优秀的水氧阻隔能力,此外,还要求 有良好的热导率、透光率、机械强度、耐腐蚀性与基底的粘结性等性质。文章对 OLED 封装材料的发展作了详细 的介绍,包括传统后盖式封装所用的金属、玻璃、陶瓷和薄膜封装所用的无机化合物、聚合物、复合材料。根据 OLED 器件的性能以及封装形式的需求,探讨了封装材料的未来发展方向。

    Abstract:

    As a potential new generation display technology, OLED has many advantages such as light weight, wide visual angle, quick response, high luminous efficiency and low cost. The research and development of OLED encapsulation materials is to prevent corrosion by oxygen and moisture from the external environment and prolong the lifetime of organic emitting materials. Besides excellent barrier properties, OLED encapsulation materials also require good thermal conductivity, luminousness, mechanical strength, corrosion resistance and good adhesion to substrate and so on. In this paper, the development of OLED encapsulation materials was introduced in detail which cover the metal, glass and ceramic used for conventional encapsulation and inorganic compounds, polymers and composite materials used for the thin film encapsulation. The development direction of OLED encapsulation materials based on the demands of packaging methods in future was also discussed.

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引文格式
张贾伟,张国平,孙 蓉,等.基于 OLED 器件的封装材料研究进展 [J].集成技术,2014,3(6):92-101

Citing format
ZHANG Jiawei, ZHANG Guoping, SUN Rong, et al. Research Progress of Encapsulation Materials for OLED[J]. Journal of Integration Technology,2014,3(6):92-101

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  • 在线发布日期: 2015-01-07
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