TP303
国家自然科学基金重大项目(92473112)
SHAO Cuiping
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China;University of Chinese Academy of Sciences, Beijing 100049, China;Faulty of Computility Microelectronics, Shenzhen University of Advanced Technology, Shenzhen 518107, China;Guangdong Provincial Key Laboratory of Computility Microelectronics, Shenzhen 518107, ChinaLI Huiyun
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China;University of Chinese Academy of Sciences, Beijing 100049, China;Faulty of Computility Microelectronics, Shenzhen University of Advanced Technology, Shenzhen 518107, China;Guangdong Provincial Key Laboratory of Computility Microelectronics, Shenzhen 518107, China
引文格式
张佳帅,杨柳青,付琦麟,等.基于芯粒架构的通信拓扑结构研究:进展与挑战 [J].集成技术,2025,14(3):1-23
Citing format
ZHANG Jiashuai, YANG Liuqing, FU Qilin, et al. Research on Communication Topologies for Chiplet Architecture: Progress and Challenges[J]. Journal of Integration Technology,2025,14(3):1-23